RJ45 MODULAR JACKS PRODUCT SPECIFICATION
RJ45 MODULAR JACKS PRODUCT SPECIFICATION
1.PRODUCT APPEARANCE
------Examination of Product
------Plating Thickness Measurement
2.ELECTRICAL PERFORMANCE
------Low Level Contact Resistance
------Insulation Resistance
------Temperature Rise
------Dielectric Withstanding Voltage
------LED Functional Test
3.MECHANICAL PERFORMANCE
------Solder ability
------Resistance to Soldering Heat
------Mating and Un-mating Force
------Durability
------Vibration
------Normal Force
------Mechanical Shock
------Static pull, plug retention to jack
------Electrical Discontinuity Test(Dynamic pull, plug retention to jack, non-operational)
4.ENVIROMENT PERFORMACE
------Thermal Shock
------Temperature Life
------Low Temperature
------Humidity
------Salt spray
1.PRODUCT APPEARANCE
------Examination of Product
------Plating Thickness Measurement
2.ELECTRICAL PERFORMANCE
------Low Level Contact Resistance
------Insulation Resistance
------Temperature Rise
------Dielectric Withstanding Voltage
------LED Functional Test
3.MECHANICAL PERFORMANCE
------Solder ability
------Resistance to Soldering Heat
------Mating and Un-mating Force
------Durability
------Vibration
------Normal Force
------Mechanical Shock
------Static pull, plug retention to jack
------Electrical Discontinuity Test(Dynamic pull, plug retention to jack, non-operational)
4.ENVIROMENT PERFORMACE
------Thermal Shock
------Temperature Life
------Low Temperature
------Humidity
------Salt spray
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